From thick film hybrid circuits to multichip modules

被引：0
|
作者：
Rappold, H.M. [1 ]
Ryckebusch, M. [1 ]
Stark, M. [1 ]
机构：
[1] Alcatel SEL Nuernberg, Germany
来源：
Alcatel Telecommunications Review | 1996年 / 2 nd Quarter期
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摘要：
2
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页码：110 / 113
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