Clean reflow soldering

被引：0

作者：

Filleul, Maria ^{[1
]}

机构：

[1] BOC Ltd, United Kingdom

来源：

EP Electronic Production (London) | 1990年 / 19卷 / 05期

关键词：

Electronics Packaging--Surface Mount Technology;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

In a previous paper, a novel soldering process designed to eliminate environmentally harmful CFC cleaning from surface mount assembly lines was reported. In this paper, the author describes this soldering process, designated Nitraclean, in more detail.

引用

页码：10 / 12