In-situ stress state measurements during chip-on-board assembly

被引：0

作者：

Zou, Yida ^{[2
]}

Suhling, Jeffrey C. ^{[1
,2
]}

Wayne Johnson, R. ^{[1
,2
]}

Jaeger, Richard C. ^{[1
,2
]}

Mian, A.K.M. ^{[2
]}

机构：

[1] IEEE

[2] Auburn University, Auburn, AL 36849, United States

来源：

IEEE Transactions on Electronics Packaging Manufacturing | 1999年 / 22卷 / 01期

关键词：

Number:; SRC-PJ-459; Acronym:; SRC; Sponsor: Semiconductor Research Corporation; -; NASA; Sponsor: National Aeronautics and Space Administration; AU; Sponsor: Auburn University;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：38 / 52