In-situ stress state measurements during chip-on-board assembly

被引：0
|
作者：
Zou, Yida [2 ]
Suhling, Jeffrey C. [1 ,2 ]
Wayne Johnson, R. [1 ,2 ]
Jaeger, Richard C. [1 ,2 ]
Mian, A.K.M. [2 ]
机构：
[1] IEEE
[2] Auburn University, Auburn, AL 36849, United States
来源：
IEEE Transactions on Electronics Packaging Manufacturing | 1999年 / 22卷 / 01期
关键词：
Number:; SRC-PJ-459; Acronym:; SRC; Sponsor: Semiconductor Research Corporation; -; NASA; Sponsor: National Aeronautics and Space Administration; AU; Sponsor: Auburn University;
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页码：38 / 52
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