共 1 条
- [1] In-situ strain measurements in the Ni/NiO system during high temperature oxidationMaterials Science and Engineering A, 1997, A222 (01): : 58 - 69Goedjen, John G.Shores, David A.Stout, James H.
In-situ stress state measurements during chip-on-board assembly
被引：0
|作者：
Zou, Yida
[2
]
Suhling, Jeffrey C.
[1
,2
]
Wayne Johnson, R.
[1
,2
]
Jaeger, Richard C.
[1
,2
]
Mian, A.K.M.
[2
]
机构：
[1] IEEE
[2] Auburn University, Auburn, AL 36849, United States
来源：
IEEE Transactions on Electronics Packaging Manufacturing
|
1999年
/
22卷
/
01期
关键词：
Number:;
SRC-PJ-459;
Acronym:;
SRC;
Sponsor: Semiconductor Research Corporation;
-;
NASA;
Sponsor: National Aeronautics and Space Administration;
AU;
Sponsor: Auburn University;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：38 / 52
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