″Internal deposition stresses″ (IDS) are the internal stresses formed during electrodeposition of a metallic coating right at the electrolyte interface. Changes in the IDS as a function of deposition time or layer thickness were determined in Watts electrolytes and in electroless nickel baths with different additives. The additives used were SiC, Al//2O//3, and benzoic acid sulfimide (C//7H//5NO//3S), single or in combination. In the Watts bath, SiC increased tensile stresses, C//7H//5NO//3S decreased tensile stresses, and Al//2O//3 seemed to have no effect. No effect was observed of SiC in electroless plating.