Stress effects on Al and Al(Cu) thin film grain-boundary diffusion

被引：0
|
作者：
Liu, X.-Y. [1 ]
Liu, C.-L. [1 ]
机构：
[1] Motorola Inc, Los Alamos, United States
来源：
Materials Research Society Symposium - Proceedings | 2000年 / 594卷
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Metallic films
引用
收藏
页码：451 / 456
相关论文
共 50 条
  • [41] Self-controlled diffusion of Al in Cu thin film
    Mozetic, M.
    Zalar, A.
    Drobnic, M.
    Vacuum, 50 (1-2): : 1 - 3
  • [42] Self-controlled diffusion of Al in Cu thin film
    Mozetic, M
    Zalar, A
    Drobnic, M
    VACUUM, 1998, 50 (1-2) : 1 - 3
  • [43] GRAIN-BOUNDARY DIFFUSION
    AUSTIN, AE
    RICHARD, NA
    JOURNAL OF APPLIED PHYSICS, 1961, 32 (08) : 1462 - &
  • [44] GRAIN-BOUNDARY DIFFUSION OF AG THROUGH CU FILMS
    SCHOEN, JM
    POATE, JM
    DOHERTY, CJ
    MELLIARSMITH, CM
    JOURNAL OF APPLIED PHYSICS, 1979, 50 (11) : 6910 - 6914
  • [45] Grain boundary diffusion of Al in Mg
    Das, Sazol Kumar
    Brodusch, Nicolas
    Gauvin, Raynald
    Jung, In-Ho
    SCRIPTA MATERIALIA, 2014, 80 : 41 - 44
  • [46] DESORPTION PROCESS BY GRAIN-BOUNDARY DIFFUSION IN THIN PLATE
    NODA, T
    OKADA, M
    TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1985, 26 (07): : 505 - 512
  • [47] GRAIN-BOUNDARY DIFFUSION KINETICS FOR THIN-FILMS
    CAMPBELL, DR
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1977, 124 (08) : C292 - C292
  • [48] GRAIN-BOUNDARY DIFFUSION - STRUCTURAL EFFECTS AND MECHANISMS
    ATKINSON, A
    JOURNAL DE PHYSIQUE, 1985, 46 (NC-4): : 379 - 391
  • [49] Grain-boundary diffusion and grain alteration of intermetallic of Fe3Al under sulphidation attack
    Tian, Xiao-Feng
    Wang, Xin
    Yin, Yan-Sheng
    Han, Ye
    Rengong Jingti Xuebao/Journal of Synthetic Crystals, 2008, 37 (03): : 726 - 729
  • [50] GRAIN-BOUNDARY DIFFUSION AND GRAIN-BOUNDARY SEGREGATION OF TELLURIUM IN SILVER
    HERZIG, C
    GEISE, J
    MISHIN, Y
    ACTA METALLURGICA ET MATERIALIA, 1993, 41 (06): : 1683 - 1691
12345