Stress effects on Al and Al(Cu) thin film grain-boundary diffusion

被引：0
|
作者：
Liu, X.-Y. [1 ]
Liu, C.-L. [1 ]
机构：
[1] Motorola Inc, Los Alamos, United States
来源：
Materials Research Society Symposium - Proceedings | 2000年 / 594卷
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Metallic films
引用
收藏
页码：451 / 456
相关论文
共 50 条
  • [31] DIFFUSION-INDUCED GRAIN-BOUNDARY MIGRATION IN AL-ZN SYSTEM
    PAWLOWSKI, A
    ZIEBA, P
    BULLETIN OF THE POLISH ACADEMY OF SCIENCES-CHEMISTRY, 1994, 42 (01): : 27 - 32
  • [32] GRAIN-BOUNDARY STRUCTURES IN RAPIDLY SOLIDIFIED CU-ZN-AL ALLOYS
    PERKINS, J
    RAYMENT, JJ
    CANTOR, B
    CAHN, RW
    SCRIPTA METALLURGICA, 1981, 15 (07): : 771 - 776
  • [33] DIFFUSION INDUCED GRAIN-BOUNDARY MIGRATION (DIGM) AND LIQUID-FILM MIGRATION (LFM) IN AN AL-2.07WT-PERCENT CU ALLOY
    KUO, M
    FOURNELLE, RA
    ACTA METALLURGICA ET MATERIALIA, 1991, 39 (11): : 2835 - 2845
  • [34] GRAIN-BOUNDARY REACTION IN CU-30-PERCENT-NI-AL ALLOYS
    MIKI, M
    AMANO, Y
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1979, 43 (06) : 551 - 557
  • [35] GRAIN-BOUNDARY DIFFUSION MODELING AND EFFICIENCY EVALUATION OF THIN-FILM DIFFUSION-BARRIERS CONSIDERING MICROSTRUCTURE EFFECTS
    GUI, X
    FRIEDRICH, LJ
    DEW, SK
    BRETT, MJ
    SMY, T
    JOURNAL OF APPLIED PHYSICS, 1995, 78 (07) : 4438 - 4443
  • [36] SUPPRESSION OF GRAIN-BOUNDARY SLIDING BY A BOUNDARY NODE IN CU-9AT-PERCENT-AL TRICRYSTALS
    OKADA, T
    ONAKA, S
    HASHIMOTO, S
    MIURA, S
    SCRIPTA METALLURGICA, 1989, 23 (01): : 49 - 54
  • [37] EFFECT OF GRAIN-BOUNDARY STRUCTURE ON STRESS-CORROSION CRACKING IN ALPHA-CU-AL ALLOY BICRYSTALS
    MIMAKI, T
    YAMASHITA, M
    HASHIMOTO, S
    MIURA, S
    JOURNAL DE PHYSIQUE, 1988, 49 (C-5): : 693 - 698
  • [38] GRAIN-BOUNDARY DIFFUSION
    KUCERA, J
    KOVOVE MATERIALY-METALLIC MATERIALS, 1991, 29 (03): : 204 - 228
  • [39] GRAIN-BOUNDARY DIFFUSION
    PETERSON, NL
    JOURNAL DE PHYSIQUE, 1982, 43 (NC-6): : 135 - 136
  • [40] STRESS-INDUCED GRAIN-BOUNDARY FRACTURES IN AL-SI INTERCONNECTS
    HINODE, K
    OWADA, N
    NISHIDA, T
    MUKAI, K
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1987, 5 (02): : 518 - 522
12345