Stress effects on Al and Al(Cu) thin film grain-boundary diffusion

被引：0
|
作者：
Liu, X.-Y. [1 ]
Liu, C.-L. [1 ]
机构：
[1] Motorola Inc, Los Alamos, United States
来源：
Materials Research Society Symposium - Proceedings | 2000年 / 594卷
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摘要：
Metallic films
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页码：451 / 456
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