Stacked CSP (chip size package) technology

被引：0
|
作者：
机构：
来源：
Shapu Giho | / 71卷 / 58-63期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
(Edited Abstract)
引用
收藏
相关论文
共 50 条
  • [1] CSP (Chip Size Package) technology for mobile apparatuses.
    Kosuga, K
    1997 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1997, 3235 : 244 - 249
  • [2] Improving the deflection of wire bonds in stacked chip scale package (CSP)
    Yao, YF
    Lin, TY
    Chua, KH
    MICROELECTRONICS RELIABILITY, 2003, 43 (12) : 2039 - 2045
  • [3] Improving the deflection of wire bonds in stacked chip scale package (CSP)
    Yao, YF
    Lin, TY
    Chua, KH
    53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1359 - 1363
  • [4] Heat transfer in a three dimensional stacked chip scale package (CSP) module
    Ragunathan, Srivathsan
    Goering, Douglas J.
    Karulkar, Pramod C.
    TWENTY-THIRD ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2007, 2007, : 244 - +
  • [5] Real chip size three-dimensional stacked package
    Yamazaki, T
    Sogawa, Y
    Yoshino, R
    Kata, K
    Hazeyama, I
    Kitajo, S
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (03): : 397 - 403
  • [6] Real chip size 3-dimensional-stacked package
    Yamazaki, T
    Yoshino, R
    Kata, K
    Sogawa, Y
    Hazeyama, I
    Kitajo, S
    NEC RESEARCH & DEVELOPMENT, 2003, 44 (03): : 235 - 240
  • [7] Wafer-level chip size package (WL-CSP)
    Töpper, M
    Fehlberg, S
    Scherpinski, K
    Karduck, C
    Glaw, V
    Heinricht, K
    Coskina, P
    Ehrmann, O
    Reichl, H
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (02): : 233 - 238
  • [8] Chip-size package technology for semiconductors
    Tessera, San Jose, United States
    Microwave J, 5 (280, 283, 285, 287, 290, 292, 294):
  • [9] Chip-size package technology for semiconductors
    Light, D
    Faraci, A
    Fjelstad, J
    MICROWAVE JOURNAL, 1998, 41 (05) : 280 - +
  • [10] Triple-chip stacked CSP
    Fukui, Y
    Yano, Y
    Juso, H
    Matsune, Y
    Miyata, K
    Narai, A
    Sota, Y
    Takeda, Y
    Fujita, K
    Kada, M
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 385 - 389
12345