Advanced Thick-film Technology - The New Generation

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Heraeus, Inc., Cermalloy Division, W. Conshohocken, PA, United States ^{[1
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Microelectron Int | / 3卷 / 51-53期

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摘要：

Thick film technology has been widely used in the past for medium performance packaging solutions, but has been unable to compete with thin-film technology for high performance requirements. The problems of poor geometrical resolution, together with high dielectric constant and loss, have all contributed to the very limited adoption of thick-film for advanced applications such as MCMs and microwave. This paper describes a new advanced ceramic based technology using thick-film conductors and dielectric. Results showing the excellent geometrical properties which result from a combination of novel materials and processing, giving line widths down to 10 microns and via dimensions of 25 micron are presented. The novel dielectric material also provides a dielectric constant of 4, with a loss factor of 1 × 10-4. This technology allows the fabrication of high density circuits and packages, offering many packaging solutions, including MCM, microwave, sensors and displays, all on one substrate.

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