THREE-DIMENSIONAL SEMICONDUCTOR CHIP PACKAGE.

被引：0
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作者：
Gruber, H.
Najmann, K.
Stadler, E.E.
Stahl, R.
Straehle, W.
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来源：
IBM technical disclosure bulletin | 1985年 / 27卷 / 09期
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摘要：
A three-dimensional semiconductor chip package is described which is suitable for low-cost mass production. The use of a plastic connecting foil eliminates thermal C4 fatigue problems.
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页码：5294 / 5295
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