Lasersonic bonding of TAB components to epoxy-glass circuit boards

被引：0
作者：
Vanderlee, Keith A. [1 ]
Porter, Raymond B. [1 ]
Kulterman, Robert W. [1 ]
Chalco, Pedro A. [1 ]
机构：
[1] IBM
来源：
Proceedings - Electronic Components and Technology Conference | 1996年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Integrated circuit manufacture
引用
收藏
页码：212 / 218
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