LSI-component Testing.

被引：0

作者：

Schneider, Birger

机构：

来源：

Elektronikcentralen (Report) ECR | 1980年 / 100期

关键词：

Compendex;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

INTEGRATED CIRCUIT TESTING

引用

共 50 条

[1] FOUR APPROACHES TO LSI TESTING.
Kapps, Charles A.
Digest of Papers - Semiconductor Test Symposium, 1979, : 101 - 109
[2] Problems in LSI Circuit Testing.
Wlodarczyk, Janusz
Meres es automatika, 1984, 32 (08): : 290 - 292
[3] FUTURE TRENDS IN COMPONENT TESTING.
FORREST, CLIFF
1982, V 11 (N 7): : 28 - 29
[4] VEHICLE COMPONENT FATIGUE TESTING.
Powell, D.E.
Journal of the Society of Environmental Engineers, 1980, 19 (03): : 23 - 26
[5] LSI COMPONENT TESTING: PROBLEMS AND SOLUTIONS.
Lenne, Winfried
New Electronics, 1979, 12 (01): : 30 - 31
[6] Motivations and Limits of Automation of Electronic Component Testing.
Benbadis, Himcha
Onde Electrique, 1977, 57 (03): : 221 - 223
[7] STATISTICAL VARIATIONS IN SM COMPONENT SOLDERABILITY TESTING.
Evans, John W.
Surface mount technology, 1987, 1 (05): : 21 - 24
[8] PEANUT IGE THRESHOLD FOR REFLEX PEANUT COMPONENT TESTING.
Altrich, M.
Wells, H. D.
Thompson, J. C.
ANNALS OF ALLERGY ASTHMA & IMMUNOLOGY, 2014, 113 (05) : A26 - A27
[9] TEST PATTERN GENERATION METHODOLOGY FOR LSI/VLSI MODULE LEVEL TESTING AND IN-CIRCUIT CARD LEVEL TESTING.
Dinwiddie, J.M.
Viele, A.A.
IBM technical disclosure bulletin, 1984, 26 (11): : 5909 - 5910
[10] TESTING.
Baker, Alan
1600, (11):