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[2]
MATERIALS MEET MODERN ELECTRONIC PACKAGING TRENDS.
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Electronic Packaging and Production,
1985, 25 (11)
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[4]
MICROELECTRONICS FOR CONSTRUCTION AND CONSTRUCTION MATERIALS EQUIPMENT - POSSIBILITIES, REQUIREMENTS, TRENDS.
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Betonwerk und Fertigteil-Technik/Concrete Precasting Plant and Technology,
1988, 54 (03)
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[6]
Thermosetting Moulding Materials - Current Situation, New Developments and Trends.
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Plastverarbeiter,
1982, 33 (09)
:1113-1117