Novel low-cost mechanical stress sensor

被引：0

作者：

Gavesi, Marco ^{[1
]}

Ricco, Bruno ^{[1
]}

Palma, Fabrizio ^{[1
]}

机构：

[1] Universita di Bologna, Bologna, Italy

来源：

Alta Frequenza Rivista Di Elettronica | 2000年 / 12卷 / 04期

关键词：

Amorphous silicon - Costs - Electronics packaging - Piezoelectric devices - Stress analysis;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

A novel device for the mechanical stress measurement is presented. The sensor based on amorphous silicon low cost technology, offers the possibility to realize highly sensitive devices to be packaged together with integrated and hybrid electronics to form a unique component, possibly including wireless input/output circuitry.

引用

页码：51 / 53