EXPERIENCE ABOUT POLYMER THICK-FILM TECHNOLOGY.

被引：0

作者：

Hulkkonen, Raimo

Jarvinen, Eero

Sortti, Vesa

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来源：

International Journal of Microcircuits and Electronic Packaging | 1982年 / 5卷 / 01期

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Compendex;

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摘要：

POLYMERS - Applications

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页码：5 / 8

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[21] Blown Film Production as an Example of Modern Plastics Extrusion Technology.
Fischer, Peter
[J]. Plastverarbeiter, 1979, 30 (03): : 117 - 125
[22] MEASUREMENT OF SOLDERABILITY OF THICK-FILM CIRCUITS - RELATIONSHIP BETWEEN SOLDER STRENGTH AND A SOLDERABILITY TEST
PANTANELLI, GP
[J]. SOLID STATE TECHNOLOGY, 1975, 18 (10) : 39 - 41
[23] NEW DU PONT COMPOSITION APPLIED IN THICK-FILM TEMPERATURE AND HUMIDITY SENSORS.
Gondek, Janusz J.
Wojcicki, Marek A.
[J]. Electrocomponent Science and Technology, 1980, 9 (01): : 93 - 100
[24] LASER DRILLING OF VIAS IN DIELECTRIC FOR HIGH-DENSITY MULTILAYER THICK-FILM CIRCUITS
COCCA, T
DAKESIAN, S
[J]. SOLID STATE TECHNOLOGY, 1978, 21 (09) : 63 - 66
[25] COMPLETE CHARACTERIZATION OF THIN- AND THICK-FILM MATERIALS USING WIDEBAND REFLECTION ACOUSTIC MICROSCOPY.
Lee, Chin C.
Tsai, Chen S.
Cheng, Xin
[J]. 1600, (SU-32):
[26] Effect of humidity on tin-oxide thick-film gas sensors in the presence of reducing and combustible gases
Natl Technical Univ of Athens, Athens, Greece
[J]. Sens Actuators, B Chem, 1 -3 pt 2 (491-494):
[27] FABRICATION OF LARGE-AREA THICK-FILM HYBRID CIRCUITS ON RCA PORCELAIN-COATED STEEL SUBSTRATES
PRABHU, AN
CONLON, EJ
MILLER, AZ
MCCUSKER, JH
HITCH, TT
[J]. RCA REVIEW, 1981, 42 (02): : 259 - 280
[28] HYBRID WITH Q-FACTOR, PASS-BAND MICROWAVE FILTER CONSTRUCTED WITH THE USE OF DIELECTRIC RESONATORS COUPLED WITH A THICK-FILM STRIP-LINE.
Gondek, Janusz J.
[J]. International Journal of Microcircuits and Electronic Packaging, 1982, 5 (03): : 24 - 27