Why flip a chip?

被引：0
|
作者：
Prasad, Ray P. [1 ]
机构：
[1] Ray Prasad Consultancy Group
来源：
Surface mount technology | 1996年 / 10卷 / 05期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Wire bond - flip chip - chip size package
    Galvanotechnik, 1 (259):
  • [42] Chip Shooter to Enable Fine Pitch Flip Chip
    Fu, Jie
    Aldrete, Manuel
    Shah, Milind
    2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 123 - 129
  • [43] Fine Pitch Flip Chip Chip Scale Packaging
    Appelt, Bernd K.
    Chung, Harrison
    Chen, Chienfan
    Wang, Raymond
    EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE, 2011,
  • [44] Novel flip chip technologies for ultra thin chip
    Takyu, Shinya
    Kiritani, Mika
    Kurosawa, Tetsuya
    Shimizu, Noriko
    Sato, Akinori
    Maeda, Jun
    Otsuka, Masahisa
    Takamatsu, Hiroyuki
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1326 - +
  • [45] Low Cost Flip Chip (LCFC): An Innovative Approach for Breakthrough Reduction in Flip Chip Package Cost
    Pendse, R.
    Cho, C. H.
    Joshi, M.
    Kim, K. M.
    Kim, P.
    Kim, S. H.
    Kim, S. S.
    Lee, H. T.
    Lee, K.
    Martin, R.
    Murphy, A.
    Pandey, V.
    Palar, C.
    2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 1 - 9
  • [46] Eutectic solder flip chip technology for Chip Scale Package
    Takubo, C
    Hirano, N
    Doi, K
    Tazawa, H
    Hosomi, E
    Hiruta, Y
    NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM, 1996, : 488 - 493
  • [47] Flip Chip Market and Technology Trends
    Beica, Rozalia
    2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC), 2013,
  • [48] Cycling copper flip chip interconnects
    Roesch, WJ
    Jittinorasett, S
    MICROELECTRONICS RELIABILITY, 2004, 44 (07) : 1047 - 1054
  • [49] Low cost solder flip chip
    Rinne, Glenn A.
    Magill, Paul A.
    Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 1997, : 113 - 114
  • [50] Flip chip package design optimization
    Shenoy, JN
    Dandia, S
    49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 232 - 237
12345