Leveraging high density packaging for high performance DSP systems

被引：0
|
作者：
Mehrotra, Pronita [1 ]
Rao, Vikram [1 ]
Conte, Tom [1 ]
Franzon, Paul [1 ]
机构：
[1] North Carolina State Univ, Raleigh, United States
来源：
IEEE Topical Meeting on Electrical Performance of Electronic Packaging | 2000年
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摘要：
8
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页码：25 / 28
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