UNDERSTAND THE BASICS OF THICK-FILM TECHNOLOGY.

As VLSI ICs grow larger, denser and more complex, manufacturing yields and reliability diminish while interconnection and packaging problems multiply. To solve this dilemma, a packaging technology is proposed that allows to: mount monolithic devices mechanically; make electrical connections between points; fabricate or install components (such as discrete resistors) that defy integration with the monolithic process; and enclose many monolithic devices in one packages. Thick-film hybrid-circuit technology meets these requirements. It permits the fabrication of low-resistivity conductors that can accommodate monolithic devices, high-precision resistors possessing a wide range of values, and capacitors of moderate values. Additionally, it accommodates the construction of complex multilayer interconnection patterns, allowing the installation of many ICs in the same package without interference. This first article of a 3-part senes focuses on thick-film materials, passive and active components, chip attachment, wire bonding and packaging.