Effect of segregation on the shape of grain boundary diffusion profiles. Experimental study of the Cu-Ag system

被引：0
|
作者：
Bernardini, J.
Toekei, Z.
Beke, D. L.
机构：
来源：
Philosophical Magazine A: Physics of Condensed Matter, Defects and Mechanical Properties | / 73卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [31] Simulation study on the nano-crystalline Cu-Ag alloys with gradient segregation
    Zhang, Feng
    Liu, Kai
    Tang, Qiaoyun
    Li, Guo
    Zhu, Dasheng
    MATERIALS LETTERS, 2023, 330
  • [32] Grain-boundary diffusion effect on a Cr-Ag bilayer system
    Lee, YS
    Lim, KY
    Chung, YD
    Choi, IS
    Whang, CN
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 1997, 31 (01) : 149 - 153
  • [33] Grain boundary and surface segregation in the Cu-Bi system
    López, GA
    Gust, W
    Mittemeijer, EJ
    SCRIPTA MATERIALIA, 2003, 49 (08) : 747 - 753
  • [34] Non-equilibrium Grain Boundary Wetting in Cu-Ag Alloys Containing W Nanoparticles
    Shu, Shipeng
    Zhang, Xuan
    Bellon, Pascal
    Averback, Robert S.
    MATERIALS RESEARCH LETTERS, 2016, 4 (01): : 22 - 26
  • [35] Surface energy and grain boundary diffusion in Ag(Cu) solid solutions
    Zhevnenko, S. N.
    Khairullin, A. K.
    MATERIALS LETTERS, 2019, 248 : 127 - 129
  • [36] First-principles study on the effect and magnetism of iron segregation in Cu grain boundary
    Fanshun Meng
    Xiaoming Lu
    Yongli Liu
    Yang Qi
    Journal of Materials Science, 2017, 52 : 4309 - 4322
  • [37] GRAIN BOUNDARY DIFFUSION IN THE AL-CU SYSTEM
    COLEMAN, C
    SMOLUCHOWSKI, R
    PHYSICAL REVIEW, 1955, 98 (05): : 1555 - 1555
  • [38] First-principles study on the effect and magnetism of iron segregation in Cu grain boundary
    Meng, Fanshun
    Lu, Xiaoming
    Liu, Yongli
    Qi, Yang
    JOURNAL OF MATERIALS SCIENCE, 2017, 52 (08) : 4309 - 4322
  • [39] Grain boundary diffusion and segregation of Bi in Cu: radiotracer measurements in B and C diffusion regimes
    Divinski, S
    Lohmann, M
    Herzig, C
    ACTA MATERIALIA, 2004, 52 (13) : 3973 - 3982
  • [40] Grain boundary diffusion, electromigration and segregation in Cu and Cu-2wt%Sn alloy
    Gupta, D
    DEFECT AND DIFFUSION FORUM, 1998, 156 : 161 - 161
12345