THERMOPLASTICS PROVE ADVANTAGEOUS IN ELECTRONICS APPLICATIONS.

被引：0

作者：

Fuchs, Edward J. ^{[1
]}

机构：

[1] Kollmorgen Corp, Glen Cove, NY, USA, Kollmorgen Corp, Glen Cove, NY, USA

来源：

Electronic Packaging and Production | 1985年 / 25卷 / 04期

关键词：

ELECTRONICS PACKAGING - Materials;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

For the last 30 years, printed circuit boards made from laminates of thermosetting resin have been the mainstay of the interconnection industry. Epoxy-glass laminates, the ubiquitous FR-4, is the standard against which any new material must match its worth. Certain engineering thermoplastics, introduced in recent years, match up very well indeed. These are cleary superior to epoxy-glass in both thermal and electrical properties. Additionally, these remarkable materials approach some of the premium performance of expensive laminates such as Teflon-glass and polyimide-glass. Engineering thermoplastics offer a combination of properties unavailable in conventional materials. While use is currently in the early stages, the potential for these materials seems great.

引用

页码：146 / 149

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