Thermal stability of W2N film as a diffusion barrier between Al and Si

被引：0
|
作者：
Noya, Atsushi [1 ]
Takeyama, Mayumi [1 ]
Sasaki, Katsutaka [1 ]
Aoyagi, Eiji [1 ]
Hiraga, Kenji [1 ]
机构：
[1] Kitami Inst of Technology, Kitami, Japan
来源：
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | 1994年 / 33卷 / 3 A期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1528 / 1529
相关论文
共 50 条
  • [41] Morphological and Compositional Studies on Al/Ti/TiN/Si, Al/TiN/Si, Al/W/Si, Al/WN/Si Systems to Test the Diffusion Barrier Properties of Nanoscale-Thick Layers between Al and Si
    Censabella, Maria
    Drago, Cristina
    Cafra, Brunella
    Badala, Paolo
    Bassi, Anna
    Piccitto, Giovanni
    Mirabella, Salvatore
    Grimaldi, Maria Grazia
    Ruffino, Francesco
    MICROMACHINES, 2021, 12 (08)
  • [42] INVESTIGATION OF Ta/Ni-Al INTEGRATED FILM USED AS A DIFFUSION BARRIER LAYER BETWEEN Cu AND Si
    Yang, Lim
    Wang, Shi Jie
    Huo, Ji Chuan
    Li, Xiao Hong
    Guo, Jian Xin
    Dai, Xiu Hong
    Ma, Lian Xi
    Zhang, Xiang Yi
    Liu, Bao Ting
    SURFACE REVIEW AND LETTERS, 2014, 21 (06)
  • [43] STUDY ON SYNTHESIS OF Mo2N AND W2N BY TPN
    Wang
    Wei
    Ren
    催化学报, 1995, (05) : 345 - 346
  • [44] THERMAL-STABILITY AND NITROGEN REDISTRIBUTION IN THE [SI]/TI/W-N/AL METALLIZATION SCHEME
    SO, FCT
    KOLAWA, E
    KATTELUS, HP
    ZHAO, XA
    NICOLET, MA
    LIEN, CD
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (06): : 3078 - 3081
  • [45] Auger electron spectroscopy study on the stability and the interfacial reaction of Ta, Ta-N and TaN films as a diffusion barrier between Cu9Al4 film and Si
    Noya, Atsushi
    Sasaki, Katsutaka
    Takeyama, Mayumi
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1993, 32 (02): : 911 - 915
  • [46] Thermal stability of nanocrystalline W-Ti diffusion barrier thin films
    WANG QingXiang
    Science China(Technological Sciences), 2010, (04) : 1049 - 1055
  • [47] Thermal stability of nanocrystalline W-Ti diffusion barrier thin films
    WANG QingXiangFAN ZhiKang LIANG ShuHua School of Materials Science and EngineeringXian University of TechnologyXian China
    Science China(Technological Sciences), 2010, 53 (04) : 1049 - 1055
  • [48] Thermal stability of nanocrystalline W-Ti diffusion barrier thin films
    QingXiang Wang
    ZhiKang Fan
    ShuHua Liang
    Science China Technological Sciences, 2010, 53 : 1049 - 1055
  • [49] Thermal stability of nanocrystalline W-Ti diffusion barrier thin films
    Wang QingXiang
    Fan ZhiKang
    Liang ShuHua
    SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 2010, 53 (04) : 1049 - 1055
  • [50] Thermal stability of a Ti-Si-N diffusion barrier in contact with a Ti adhesion layer for Au metallization
    Shalish, I.
    Shapira, Yoram
    Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena, 1999, 17 (01):
12345