Fine pitch surface mount technology assembly with lead-free, low residue solder paste

被引：0
|
作者：
AT&T Bell Lab, Princeton, United States [1 ]
机构：
来源：
Soldering Surf Mount Technol | / 20卷 / 27-32期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [31] Investigation of jet printing performance of lead-free solder paste
    Li, Saipeng
    Wang, Yanqing
    Zhou, Jian
    Xue, Feng
    2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 709 - 712
  • [32] A new bumping process using lead-free solder paste
    Suga, T
    Saito, K
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2002, 25 (04): : 253 - 256
  • [33] Characterization for Dynamic Micro Wetting of Lead-Free Solder Paste
    Yasuda, Kiyokazu
    ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 1349 - 1352
  • [34] Analysis of lead-free solder paste based on performance degradation
    Li, Cui
    Lei, Yongping
    Lin, Jian
    Tian, Ye
    2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 375 - 379
  • [35] Development and validation of a lead-free alloy for solder paste applications
    Laine-Ylijoki, Tommi
    Steen, Hector
    Forsten, Atso
    IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, 1997, 20 (03): : 194 - 198
  • [36] Reliability of solder paste and solder pre-coating technology by lead-free Sn-Zn base solder alloy
    Sakai, T
    Amita, H
    Shibuya, Y
    Kurozumi, T
    Nagasaki, S
    Shoji, T
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 293 - 302
  • [37] Lead-free solder process implementation for PCB assembly
    Collier, P
    Sunappan, V
    Periannan, A
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2002, 14 (03) : 12 - 18
  • [38] Risk assessment methodology for lead-free solder assembly
    Charles Stark Draper Laboratory, 555 Technology Square, Cambridge, MA 02139-3563, United States
    Proc. - Int. Symp. Microelectron., IMAPS, (174-181):
  • [39] Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration
    Lee, Ching-Kuan
    Chang, Tao-Chih
    Lau, John H.
    Huang, Yu-Jiau
    Fu, Huan-Chun
    Huang, Jui-Hsiung
    Hsiao, Zhi-Cheng
    Ko, Cheng-Ta
    Cheng, Ren-Shin
    Chang, Pei-Chen
    Kao, Kuo-Shu
    Lu, Yu-Lan
    Lo, Robert
    Kao, Ming-Jer
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 2 (08): : 1229 - 1238
  • [40] Reliability study of surface mount printed circuit board assemblies with lead-free solder joints
    Lo, Jeffery C. C.
    Jia, B. F.
    Liu, Z.
    Zhu, J.
    Lee, S. W. Ricky
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2008, 20 (02) : 30 - 38
12345