Material models for SnPb solders and underfill in electronic packaging and their application

被引：0

作者：

Guozhong, W. ^{[1
]}

Liu, C. ^{[1
]}

Zhaonian, C. ^{[1
]}

机构：

[1] Shanghai Institute of Metallurgy, Chinese Academy of Science, Shanghai, China

来源：

Jixie Gongcheng Xuebao/Chinese Journal of Mechanical Engineering | 2000年 / 36卷 / 12期

关键词：

Anelastic relaxation - Computer simulation - Creep - Deformation - Electronics packaging - Fatigue of materials - Fillers - Mathematical models - Numerical analysis - Thermal cycling - Thermal effects - Tin alloys - Viscoplasticity;

D O I：

10.3901/jme.2000.12.033

中图分类号：

学科分类号：

摘要：

The unified viscoplastic Anand model is employed to represent the inelastic deformation behavior of SnPb solders. Based on the experimental data and the elsto-plasto-creep model, the material parameters of Anand model for 92.5Pb5Sn2.5Ag and 60Sn40Pb solders are determined. The linear viscoelastic Maxwell model is applied to describe the modulus and volume relaxation of a underfill material U8347-3 in flip chip package and the relaxation coefficients are obtained. In addition, the stress/strain responses of flip chip package under thermal cycling are simulated with finite element method. The viscoplastic strain and thermal fatigue lifetimes of SnPb solder joints are analyzed. The results show that the viscoplastic Anand and the linear viscoelastic Maxwell models can be used to represent the mechanical behaviors of SnPb solders and underfill material, respectively. The material models can be applied to the reliability simulation and analysis of electronic packages.

引用

页码：33 / 38