Interactions between lead oxide and ceramic substrates for thick film technology

被引:0
|
作者
Bersani, Massimo [1 ]
Morten, Bruno [1 ]
Prudenziati, Maria [1 ]
Gualtieri, Alessandro [1 ]
机构
[1] Univ of Modena, Modena, Italy
关键词
Activation energy - Alumina - Composition effects - Crystal microstructure - Crystallization - Granular materials - Interfaces (materials) - Lead compounds - Reaction kinetics - Substrates - Thick films;
D O I
暂无
中图分类号
学科分类号
摘要
This paper deals with the mechanisms and kinetics of interactions between screen printed and fired PbO layers and ceramic substrates: alumina and beryllia. The interaction with alumina occurs via two main processes: (i) a reaction between PbO and Al2O3 grains, which induces the formation of a crystalline phase, Pb2Al2O5; and (ii) an interdiffusion process involving Pb and the intergranular amorphous phase in the ceramic substrate. This latter process results in a compositional change of the intergranular phase at considerable depths inside the ceramic substrate, as well as in the formation of a high lead glass layer on the substrate surface. Since PbO is not completely reacted, the Pb penetration in the ceramic is diffusion limited (penetration depth wtd1/2, where td is the reaction time) with an activation energy of 1.20±0.05 eV. The ceramic microstructure significantly affects the interaction processes.
引用
收藏
相关论文
共 50 条
  • [41] A novel thick film on ceramic MCM technology offering MCM-D performance
    Barnwell, P
    Wood, J
    1997 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES - PROCEEDINGS, 1997, : 48 - 52
  • [42] Smart label uses polymer thick film technology on low-cost substrates
    Luniak, M
    Monser, HP
    Brod, V
    Wolter, KJ
    POLYTRONIC 2001, PROCEEDINGS, 2001, : 314 - 318
  • [43] Environmental evaluation of thick film ceramic fabrication techniques for solid oxide fuel cells
    Hart, N
    Brandon, N
    Shemilt, J
    MATERIALS AND MANUFACTURING PROCESSES, 2000, 15 (01) : 47 - 64
  • [44] An Investigation of Lead-free Thick-film Resistors on LTCC Substrates - Preliminary Results
    Hrovat, Marko
    Kielbasinski, Konrad
    Makarovic, Kostja
    Belavic, Darko
    Lakubowska, Malgorzata
    EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE, 2011,
  • [45] THICK-FILM TECHNOLOGY
    PRUDENZIATI, M
    SENSORS AND ACTUATORS A-PHYSICAL, 1991, 25 (1-3) : 227 - 234
  • [46] THICK-FILM TECHNOLOGY
    FUNK, W
    PHILIPS TECHNICAL REVIEW, 1975, 35 (05): : 144 - 150
  • [47] THICK-FILM TECHNOLOGY
    OCONNELL, JA
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1967, 4 (05): : 331 - &
  • [48] THICK-FILM TECHNOLOGY
    FUNK, W
    ACTA ELECTRONICA, 1978, 21 (04): : 251 - 255
  • [49] Low dielectric constant thick film silver and gold systems characterization for high frequency ceramic substrates
    Kellerman, D
    Nabatian, DJ
    Retherford, L
    Barlow, F
    Elshabini, A
    1998 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1998, 3582 : 795 - 801
  • [50] Interactions between barium strontium titanate (BST) thick films and alumina substrates
    Su, B
    Button, TW
    JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2001, 21 (15) : 2777 - 2781