共 50 条
- [31] EVOLUTION OF CERAMIC SUBSTRATES FOR THICK AND THIN-FILM COMPONENTS AND CIRCUITS IN UNITED-STATES AMERICAN CERAMIC SOCIETY BULLETIN, 1977, 56 (06): : 580 - 585
- [34] Plated copper on thick film ceramic substrates and their packaging applications for deep-ultraviolet LEDs 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
- [36] Thick-film resistors on glass ceramic substrates as smart strain sensing aggregates for SHM SENSORS AND SMART STRUCTURES TECHNOLOGIES FOR CIVIL, MECHANICAL, AND AEROSPACE SYSTEMS 2018, 2018, 10598
- [37] Screen printing process design of experiments for fine line printing of thick film ceramic substrates 1998 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1998, 3582 : 264 - 269
- [38] CERAMIC GLAZES FOR THICK FILM MICROELECTRONICS AMERICAN CERAMIC SOCIETY BULLETIN, 1968, 47 (06): : 565 - +
- [39] Research of Reflow Soldering on Al-SiC Composite Material and Thick Film Ceramic Substrates 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 895 - 897
- [40] Screen printing process design of experiments for fine line printing of thick film ceramic substrates J Electron Manuf, 3 (203-213):