Mechanism for interfacial adhesion strength of an ion beam mixed Cu/polyimide with a thin buffer layer

被引：0
作者：
机构：
来源：
Appl Phys Lett | / 4卷 / 522期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] Enhancement of Interfacial Adhesion between carbon nanotube thin film and substrate using a gold-nickel buffer layer
    Liang, Qingan
    Zhang, Yu
    Ke, Yanlin
    Chen, Jun
    Xu, Ningsheng
    Deng, Shaozhi
    2016 29TH INTERNATIONAL VACUUM NANOELECTRONICS CONFERENCE (IVNC), 2016,
  • [22] Improvement of Adhesion of Copper on Polyimide by Reactive Ion-Beam Etching
    Ruoff, Arthur L.
    Kramer, Edward J.
    Li, Che-Yu
    IBM Journal of Research and Development, 1988, 32 (05): : 626 - 630
  • [23] IMPROVEMENT OF ADHESION OF COPPER ON POLYIMIDE BY REACTIVE ION-BEAM ETCHING
    RUOFF, AL
    KRAMER, EJ
    LI, CY
    IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1988, 32 (05) : 626 - 630
  • [24] Enhanced adhesion of Cu-W thin films by ion beam assisting bombardment implanting
    Zhou Ling-ping
    Wang Ming-pui
    Wang Rui
    Li Zhou
    Zhu Jia-jun
    Peng Kun
    Li De-yi
    Li Shao-lu
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2008, 18 (02) : 372 - 377
  • [25] Enhanced adhesion of Cu-W thin films by ion beam assisting bombardment implanting
    周灵平
    汪明朴
    王瑞
    李周
    朱家俊
    彭坤
    李德意
    李绍禄
    TransactionsofNonferrousMetalsSocietyofChina, 2008, (02) : 372 - 377
  • [26] The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films
    Miyamura, T.
    Koike, J.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2007, 445 : 620 - 624
  • [27] SPECULATIONS ON A MECHANISM FOR THE ION-BEAM INDUCED DEGRADATION OF POLYIMIDE
    DAVENAS, J
    BOITEUX, G
    FALLAVIER, M
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1989, 39 (1-4) : 796 - 799
  • [28] Plasma surface pretreatment to improve interfacial adhesion strengths of sputtered Cu on polyimide film
    Wang, Enze
    Song, Yutao
    Shang, Lunlin
    Zhang, Guangan
    Wang, Shunhua
    SURFACE TOPOGRAPHY-METROLOGY AND PROPERTIES, 2022, 10 (04)
  • [29] A Study on the Adhesion Properties of Reactive Sputtered Molybdenum Thin Films with Nitrogen Gas on Polyimide Substrate as a Cu Barrier Layer
    Kim, Hong Sik
    Kim, Byoung O.
    Seo, Jong Hyun
    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2015, 15 (11) : 8743 - 8748
  • [30] Effects of Silane Coupling Agents on the Adhesion Strength of a Printed Cu Circuit on Polyimide
    Lee, Choong-Jae
    Park, Bum-Geun
    Jung, Kwang-Ho
    Kim, Yongil
    Jung, Seung-Boo
    SCIENCE OF ADVANCED MATERIALS, 2020, 12 (04) : 594 - 599
12345