Heated gas jet reflow: an alternative reflow solder assembly process technology

被引：0
|
作者：
Lichtenberg, L.R. [1 ]
Gillespie, P.J. [1 ]
机构：
[1] Motorola SPS Hybrid Power Module, Group, Phoenix, United States
来源：
Soldering and Surface Mount Technology | 1997年 / 25期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：13 / 16
相关论文
共 50 条
  • [21] Local melt process of solder bumping by induction heating reflow
    Xu, Hongbo
    Li, Mingyu
    Fu, Yonggao
    Wang, Ling
    Kim, Jongmyung
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2009, 21 (04) : 45 - 54
  • [22] Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process
    Ming, Lau Hong
    Debnath, Sujan
    Johar, Mahzan
    Asasaari, Siti Faizah Mad
    Januddi, Mohd Al Fatihhi Szali
    Kosnan, Mohamad Shahrul Effendy
    INTERNATIONAL JOURNAL OF ONLINE AND BIOMEDICAL ENGINEERING, 2022, 18 (08) : 142 - 153
  • [23] A study of normal, restoring, and fillet forces and solder bump geometry during reflow in concurrent underfill/reflow flip chip assembly
    Zhao, R
    Zhang, Y
    Johnson, RW
    Harris, DK
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 699 - 703
  • [24] Development of warpage measurement system to simulate convective solder reflow process
    Powell, Reinhard E.
    Ume, I. Charles
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2008, 31 (01): : 83 - 90
  • [25] THERMAL MODELING OF THE INFRARED REFLOW PROCESS FOR SOLDER BALL CONNECT (SBC)
    MAHANEY, HV
    IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1993, 37 (05) : 609 - 619
  • [26] Characterization of a No-Flow underfill encapsulant during the solder reflow process
    Wong, CP
    Baldwin, D
    Vincent, MB
    Fennell, B
    Wang, LJ
    Shi, SH
    48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 1253 - 1259
  • [27] A Novel Approach to Optimizing Solder Reflow Process in Assembling PQFN Packages
    Yu, Youmin
    Su, Y. Q.
    Yao, S. A.
    Jiang, Y. W.
    Wang, Sonder
    IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1, 2010, : 329 - 334
  • [28] Investigation of the Assembly Reflow Process and PCB Design on the Reliability of WLCSP
    Liu, Yong
    Qian, Qiuxiao
    Qu, Shichun
    Martin, Stephen
    Jeon, Oseob
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 959 - 964
  • [29] Assembly process issues in integrating commercial reflow encapsulants into flip chip assembly
    Mun, JH
    Prats, A
    Borgesen, P
    Srihari, K
    ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001, 2001, : 150 - 154
  • [30] Materials to integrate the solder reflow and underfill encapsulation processes for flip chip on board assembly
    Gamota, Daniel
    Melton, Cindy
    IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, 1998, 21 (01): : 57 - 65
12345