Heated gas jet reflow: an alternative reflow solder assembly process technology

被引：0
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作者：
Lichtenberg, L.R. [1 ]
Gillespie, P.J. [1 ]
机构：
[1] Motorola SPS Hybrid Power Module, Group, Phoenix, United States
来源：
Soldering and Surface Mount Technology | 1997年 / 25期
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页码：13 / 16
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