PACKAGING TRENDS IN DISCRETE SURFACE MOUNT COMPONENTS.

被引：0
|
作者：
Hollander, Dave [1 ]
机构：
[1] Motorola Inc, Phoenix, AZ, USA, Motorola Inc, Phoenix, AZ, USA
来源：
Surface mount technology | 1987年 / 1卷 / 04期
关键词：
DIODE PACKAGES - SURFACE MOUNT COMPONENTS;
D O I：
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中图分类号：
学科分类号：
摘要：
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页码：9 / 11
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