Establishing control of the solder reflow process

被引：0

作者：

Amir, Dudi ^{[1
]}

机构：

[1] Intel Inc, Hillsboro, United States

来源：

Electronic Packaging and Production | 1998年 / 38卷 / 07期

关键词：

Flip chip devices - Metallurgy - Process control - Silver plating - Soldering - Surface mount technology - Temperature control;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

A series of experiments was conducted to evaluate a process monitoring system as a potential process control tool for indicating changes in the reflow oven during production that might affect product quality. The data from the tests were used to create a process control system that would ensure the production of high-quality boards.

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