DESIGN GUIDELINES FOR THICK-FILM HYBRID CIRCUITS.

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作者：
Dryden, William G.
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来源：
Electronic Packaging and Production | 1979年 / 19卷 / 07期
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Compilation and indexing terms; Copyright 2025 Elsevier Inc;
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摘要：
INTEGRATED CIRCUITS, HYBRID
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页码：140 / 145
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