Effect of ligand type on electroless copper deposition

被引：0
|
作者：
Vaskelis, A.
Norkus, E.
Juskenas, R.
Matulionis, E.
Stalnionis, G.
机构：
来源：
Galvanotechnik | 1995年 / 86卷 / 07期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：2114 / 2123
相关论文
共 50 条
  • [1] LIGAND EFFECTS IN ELECTROLESS COPPER DEPOSITION
    PAUNOVIC, M
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1977, 124 (03) : 349 - 354
  • [2] THE EFFECT OF PH ON ELECTROLESS COPPER DEPOSITION
    DUFFY, J
    PEARSON, L
    PAUNOVIC, M
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (04) : 876 - 880
  • [3] Effect of buffer on electroless copper deposition
    Kou, SC
    Hung, A
    PLATING AND SURFACE FINISHING, 2002, 89 (02): : 48 - 52
  • [4] THE EFFECT OF SOME ADDITIVES ON ELECTROLESS COPPER DEPOSITION
    PAUNOVIC, M
    ARNDT, R
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (04) : 794 - 799
  • [5] Influence of EDTA/THPED Dual-Ligand on Copper Electroless Deposition
    Lu Jianhong
    Yun, Jimmy
    Lei Haiping
    Tu Jiguo
    Jiao Shu-qiang
    INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2018, 13 (06): : 6015 - 6026
  • [6] Catalytic effect of Pd nanoparticles on electroless copper deposition
    Lee, Chien-Liang
    Huang, Yu-Ching
    Kuo, Li-Chen
    JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2007, 11 (05) : 639 - 646
  • [7] Catalytic effect of Pd nanoparticles on electroless copper deposition
    Chien-Liang Lee
    Yu-Ching Huang
    Li-Chen Kuo
    Journal of Solid State Electrochemistry, 2007, 11 : 639 - 646
  • [8] COMPUTER STUDY OF PH EFFECT IN ELECTROLESS COPPER DEPOSITION
    PAUNOVIC, M
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1978, 125 (01) : 173 - 174
  • [9] Electroless Copper Plating on a Cotton Surface: Effect of Metal Ion Ligand Stability Constant on Reduction Deposition
    Jiang, Tao
    Wan, Jiajia
    Zong, Yuting
    Gui, Chengmei
    Chen, Zhenming
    Huang, Junjun
    LANGMUIR, 2024, 40 (31) : 16283 - 16290
  • [10] Effect of triethanolamine on deposition rate of electroless copper plating
    Jiang, H. Y.
    Liu, Z. J.
    Wang, X. W.
    Wang, Z. L.
    TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2007, 85 (02): : 103 - 106
12345