Crack initiation and propagation behavior of three types of solders is torsion low cycle fatigue

被引：0

作者：

Nose, Haruo ^{[1
]}

Sakane, Masao ^{[1
]}

Yamashita, Mitsuo ^{[1
]}

Shiokawa, Kunio ^{[1
]}

机构：

[1] Dept. of Mech. Eng. for Transp., Osaka Sangyo University, Daito-shi, Osaka, 574-8530

来源：

Nippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A | 2003年 / 69卷 / 08期

关键词：

Crack propagation; Electronic device; J-integral; Solder; Torsion low cycle fatigue;

D O I：

10.1299/kikaia.69.1222

中图分类号：

学科分类号：

摘要：

This paper studies the crack initiation and propagation behavior of three types of solders. Hollow cylinder tube specimens of Sn-37 Pb, Sn-93.5 Pb-1.5 Ag and Sn-7.5 Bi-2 Ag-0.5 Cu solders were torsionally fatigued at 313 K at a Mises strain rate of 0.5%/s. Crack initiation and propagation behavior was observed by a replication method. Cracks were initiated in the life ratio less than 0.05, so that the crack propagation was the main fatigue damage process. Main cracks propagated in the maximum shear direction for Sn-37 Pb and Sn-93.5 Pb-1.5 Ag but in the maximum principal direction for Sn-7.5 Bi-2 Ag-0.5 Cu. The main crack propagation was uniquely correlated with the life ratio, independent of the strain range and types of solders. Combining this correlation with Manson-Coffin rule, an equation that describes the relationship between crack length, plastic strain range and number of cycles was discussed. The equation evaluated the remaining life by knowing crack length and plastic strain range.

引用

页码：1222 / 1229

页数：7