FLEXIBLE MODULE CARRIER DIRECT CONNECTION PACKAGE.

By utilizing the Flexible Module Carrier (FMC) interconnection technology and the new Industry Standard JEDEC (Joint Electron Device Engineering Council), Type B or C, module packaging, memory modules may be more efficiently added to a system card. The FMC connector has a gold module pad mated to a gold pad directly processed onto the flex circuit, providing improved reliability. The JEDEC modules are now directly connected to a base carrier, the flex circuit, eliminating the need for separate module sockets. The individual modules are easily field-replaceable by removing retention bars which are metal and provide a cooling path for the modules.