Future outlook for hybrids

被引：0

作者：

Loeb, William E. ^{[1
]}

Henderson, Edward ^{[1
]}

机构：

[1] Wm. E. Loeb & Assoc, United States

来源：

Hybrid circuit technology | 1990年 / 7卷 / 01期

关键词：

Integrated Circuit Manufacture - Integrated Circuits--Applications;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Hybrid circuits have always served as an interconnection crucible. Their use in this regard will increase as the needs for closer spacing of uncased integrated circuit chips accelerate. Hybrids also have served as a device or component solution for small-to-medium volume applications, especially for linear devices. In these cases, however, growth will decline as ASIC technology captures a greater share of the analog market. Topics discussed are market trends; technology trends; and thin film production.

引用

页码：31 / 32