High speed GaAs ICs (Integrated Circuits) using FETs (Field Effect Transistors) are reported. As the fabricating techniques, ion implantation processes for both 0.5 μm and 0.2μm gate FETs using W/Al refractory metal and 0.2 μm recessed gate process with MBE grown epitaxial wafers are shown. These fabrication processes are selected depending on the circuit speed and the integration level. The outline of the circuit design and the examples of ICs, which are developed for 10 Gb/s optical communication systems, are also shown with the obtained characteristics.