HIGH-SPEED WIRING TEST SYSTEM FOR PRINTED WIRING BOARD.

被引：0

作者：

Itoh, Seiichi

Hoshiai, Fumihiro

Suzuki, Masatoshi

机构：

来源：

NEC Research and Development | 1978年 / 49期

关键词：

D O I：

暂无

中图分类号：

TN7 [基本电子电路];

学科分类号：

080902 ;

摘要：

This paper describes a system which is used to electrically test the wiring condition of printed wiring boards or multilayer boards. The system is intended to test printed wiring boards of various kinds and patterns while minimizing preparation work and test time. The system consists of a minicomputer as the center, a disk cartridge unit as a data input device, a scanner using CMOS IC packages and a probe unit consisting of about 16,000 test points which can be connected at one time.

引用

页码：32 / 39

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[11] TRANSPORTER SYSTEM FOR A PRINTED WIRING BOARD SHOP [J].

LONG, TB .

WESTERN ELECTRIC ENGINEER, 1978, 22 (01) :36-40

[12] Wiring of High-speed Switches in Austria [J].

Hofbauer, Gerhard .

eb - Elektrische Bahnen, 2022, 120 (1-2) :30-37

[13] WIRING FOR HIGH-SPEED CIRCUITS. [J].

DeClue, Joseph L. .

Electronic Design, 1976, 24 (11) :84-86

[14] HIGH-DENSITY MULTILAYER PRINTED WIRING BOARD [J].

KOBUNA, H ;

NOGUCHI, S ;

ATARASHI, T .

NEC RESEARCH & DEVELOPMENT, 1979, (53) :30-35

[15] AN AUTOMATIC INSPECTION SYSTEM FOR PRINTED WIRING BOARD MASKS [J].

GOTO, N ;

KONDO, T .

PATTERN RECOGNITION, 1980, 12 (06) :443-455

[16] Applications of closed-form wiring escape formulae to a high performance printed wiring board [J].

Zhou, TD ;

Katopis, GA .

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2003, :225-228

[17] My future printed wiring board [J].

Journal of Japan Institute of Electronics Packaging, 2013, 16 (01) :12-14

[18] Optical interconnect on printed wiring board [J].

Karppinen, M ;

Mäkinen, JT ;

Kataja, K ;

Tanskanen, A ;

Alajoki, T ;

Karioja, P ;

Immonen, M ;

Kivilahti, J .

PHOTONICS PACKAGING AND INTEGRATION IV, 2004, 5358 :135-145

[19] The stream of printed wiring board industry [J].

Toda, Mitsuaki .

Journal of Japan Institute of Electronics Packaging, 2015, 18 (02)

[20] Miniaturization of Printed Wiring Board Assemblies into System in a Package (SiP) [J].

Rosser, Steven G. ;

Memis, Irving ;

Von Hofen, Harry .

2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, :746-753

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