FULLY AUTOMATED INTEGRATED CIRCUIT WIRE BONDING SYSTEM.

被引：0
作者：
Naruse, Masayuki
Miyazaki, Susumu
Yamada, Tatsuru
Kawata, Kouichi
Sakagawa, Yasuo
Igarashi, Ken-ichi
机构：
来源：
NEC Research and Development | 1980年 / 56期
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摘要：
A pattern recognition technique has been introduced into the IC assembly process and the wire bonding operation has been fully automated. The system combines an image processing unit (IPU), wire bonding machines and line-sensor camera. One IPU determines the exact position of five bonding tools. The algorithm utilized detects a special array of electrodes on an IC pellet surface, which requires a comparatively small scanning field.
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页码：163 / 169
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