Effects of curing conditions and test temperatures on the strength of adhesive-bonded joints

被引：0
|
作者：
Matsui, K. [1 ]
机构：
[1] Univ of Tokushima Bunri, Tokushima, Japan
来源：
International Journal of Adhesion and Adhesives | 1990年 / 10卷 / 04期
关键词：
Joints; Adhesive;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：277 / 284
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