ADVANCES IN ELECTROLYTIC COPPER PLATING OF PRINTED CIRCUIT BOARDS.

被引：0

作者：

Carano, Michael ^{[1
]}

机构：

[1] Electrochemicals Inc, Youngstown,, OH, USA, Electrochemicals Inc, Youngstown, OH, USA

来源：

Electri-onics | 1986年 / 32卷 / 03期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：29 / 32

共 50 条

[31] New Fabrication Facilities for Printed-Circuit Boards.
Augsburg, Gunter
Hoffman, Manfred
Wuensche, Hatto
Siemens-Zeitschrift, 1976, 50 (04): : 222 - 224
[32] COMPUTER SYSTEM ACCELERATES DESIGN OF PRINTED CIRCUIT BOARDS.
Allum, Bob
Paterson, John
Shastry, Balakrishna
1600, (04):
[33] REMOVING SOLDER BRIDGES FROM PRINTED CIRCUIT BOARDS.
Comerford, M.F.
Insulation, circuits, 1981, 27 (04): : 31 - 34
[34] New Method of Computer Layout of Printed Circuit Boards.
Schenke, W.
Elektronik Produktion & Prueftechnik, 1981, (09): : 478 - 479
[35] HOW TO SELECT A CONFORMAL COATING FOR PRINTED CIRCUIT BOARDS.
Waryold, John
Insulation/Circuits, 1974, 20 (07): : 29 - 31
[36] FLUXES FOR MASS-SOLDERING PRINTED CIRCUIT BOARDS.
WILLUMSEN, A.
1981,
[37] POWER SUPPLY CONSTRUCTION FOR USE ON PRINTED CIRCUIT BOARDS.
Henley, B.L.
Joy, E.F.
Nealy, J.C.
Wheeler, W.R.
IBM technical disclosure bulletin, 1983, 26 (04): : 1853 - 1854
[38] ADDITIVE METHODS FOR PRODUCTION OF PRINTED-CIRCUIT BOARDS.
Kalikhman, V.L.
Khas'kin, O.S.
Soviet electrical engineering, 1979, 50 (04): : 72 - 76
[39] Automatic Adjustment Associated with Testing of Printed Circuit Boards.
Muehlbauer, H.
Elektronik Produktion & Prueftechnik, 1987, (09): : 23 - 24
[40] ELECTROMECHANICAL RELAYS GAINING SPACE ON PRINTED CIRCUIT BOARDS.
MORRIS, HENRY M.
1982, V 29 (N 12): : 78 - 79