ADVANCES IN ELECTROLYTIC COPPER PLATING OF PRINTED CIRCUIT BOARDS.

被引:0
|
作者
Carano, Michael [1 ]
机构
[1] Electrochemicals Inc, Youngstown,, OH, USA, Electrochemicals Inc, Youngstown, OH, USA
来源
Electri-onics | 1986年 / 32卷 / 03期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
11
引用
收藏
页码:29 / 32
相关论文
共 50 条
  • [21] UNDERSTANDING ELECTRICAL MEASUREMENTS OF PRINTED CIRCUIT BOARDS.
    Manfield, H.G.
    Circuit World, 1985, 11 (04) : 28 - 31
  • [22] Automatic Adjustment of Relays for Printed Circuit Boards.
    Meissner, M.
    Noennig, R.
    Schorcht, H.-J.
    Weiss, M.
    Feingeratetechnik Berlin, 1987, 36 (06): : 247 - 249
  • [23] Universal Adapter for Testers of Printed Circuit Boards.
    Colbert, Dennis M.
    Elektronik Produktion & Prueftechnik, 1981, : 306 - 308
  • [24] TESTING OF UNPOPULATED SMD PRINTED CIRCUIT BOARDS.
    Prokopp, M.
    Circuit World, 1987, 13 (04) : 42 - 43
  • [25] Technological Problems and Their Solution for Printed Circuit Boards.
    Bogenschuetz, August F.
    Jostan, Josef L.
    Wissenschaftliche Berichte AEG-Telefunken, 1979, 52 (1-2): : 64 - 71
  • [26] New Technologies in the Manufacture of Printed Circuit Boards.
    Michalski, Jerzy
    Elektronika Warszawa, 1981, 22 (11-12): : 27 - 29
  • [27] PLUGGABLE INTERFACE PACKAGING FOR PRINTED CIRCUIT BOARDS.
    Uberbacher, E.C.
    IBM technical disclosure bulletin, 1983, 25 (12): : 6717 - 6718
  • [28] HIGH SPEED DIGITAL PRINTED CIRCUIT BOARDS.
    Keeler, Robert
    Electronic Packaging and Production, 1986, 26 (01): : 140 - 145
  • [29] PULSE-REVERSE COPPER PLATING FOR PRINTED-CIRCUIT BOARDS
    HALL, WF
    CHAUDHURI, AR
    PLATING AND SURFACE FINISHING, 1982, 69 (11): : 46 - 46
  • [30] ELECTROCHEMICAL MECHANISM OF ELECTROLESS COPPER PLATING OF PRINTED-CIRCUIT BOARDS
    ETKINA, LI
    SHEPELIN, VA
    KASATKIN, EV
    ALFIMOV, VI
    SOVIET ELECTROCHEMISTRY, 1986, 22 (10): : 1288 - 1293