ADVANCES IN ELECTROLYTIC COPPER PLATING OF PRINTED CIRCUIT BOARDS.

被引:0
|
作者
Carano, Michael [1 ]
机构
[1] Electrochemicals Inc, Youngstown,, OH, USA, Electrochemicals Inc, Youngstown, OH, USA
来源
Electri-onics | 1986年 / 32卷 / 03期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
11
引用
收藏
页码:29 / 32
相关论文
共 50 条
  • [1] Currentless Copper Plating of Multilayer Printed Circuit Boards.
    Beier, Ernst
    Elektronikpraxis, 1980, 15 (12): : 76 - 79
  • [2] Printed Circuit Boards.
    Taubitz, Gerhard
    Elektronik Munchen, 1983, 32 (21): : 90 - 116
  • [3] Surface preparation before chemical copper plating of holes in printed circuit boards. Part I
    Grigoryan, N. S.
    Savitskaya, S. A.
    Asnis, N. A.
    Bardina, O. I.
    Abrashov, A. A.
    Vagramyan, T. A.
    Dragunova, A. Yu.
    INTERNATIONAL JOURNAL OF CORROSION AND SCALE INHIBITION, 2022, 11 (04): : 1593 - 1603
  • [4] BETTER UNDERSTANDING OF THE THROUGH-HOLE PLATING OF PRINTED CIRCUIT BOARDS.
    Jackson, B.C.
    House, J.R.
    Nagi, S.K.
    Transactions of the Institute of Metal Finishing, 1982, 60 (pt 4): : 131 - 136
  • [5] ROUTING OF PRINTED CIRCUIT BOARDS.
    Aranoff, S.
    Abulaffio, Y.
    Proceedings - Design Automation Conference, 1981, : 130 - 136
  • [6] NEW PRINTED CIRCUIT BOARDS.
    Yanagihara, Kohtaro
    Gaku, Morio
    Sugie, Soji
    1600, (08):
  • [7] Coating Varnishes for Printed Circuit Boards.
    Olesen, S.T.
    Villien, P.
    Willumsen, A.
    Elektronikcentralen (Report) ECR, 1979, (88):
  • [8] Inductive Soldering of Printed Circuit Boards.
    Wolf, Hans-Juergen
    ZIS Mitteilungen, 1973, 15 (04): : 413 - 418
  • [9] Testing LSI Printed Circuit Boards.
    Poehlmann, Bernd
    Giesbrecht, Dieter
    Messen und Pruefen, 1979, 15 (03): : 117 - 120
  • [10] WAVE SOLDERING OF PRINTED CIRCUIT BOARDS.
    Dubey, G.C.
    Journal of the Institution of Electronics and Telecommunication Engineers, 1975, 21 (07): : 386 - 388