New technology of electroless gold plating on PCB

被引：0

作者：

Hu, Wencheng

Chi, Lanzhou

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来源：

Dianzi Keji Daxue Xuebao/Journal of University of Electronic Science and Technology of China | 1995年 / 24卷 / 06期

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[1] New technology of electroless gold plating on PCB
Dianzi Keji Diaxue Xuebao, 6 (658-661):
[2] A New Electroless Cu plating Technology
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[3] Electroless gold plating
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[5] ELECTROLESS GOLD BEAM LEAD PLATING
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