SOI wafer flow process for stencil mask fabrication

被引:0
作者
Butschke, J. [1 ]
Ehrmann, A. [2 ]
Höfflinger, B. [1 ]
Irmscher, M. [1 ]
Käsmaier, R. [2 ]
Letzkus, F. [1 ]
Löschner, H. [3 ]
Mathuni, J. [2 ]
Reuter, C. [1 ]
Schomburg, C. [1 ]
Springer, R. [1 ]
机构
[1] Inst. fur Mikroelektronik Stuttgart, Allmandring 30a, 70569 Stuttgart, Germany
[2] Siemens AG, Otto-Hahn-Ring 6, 81739 München, Germany
[3] Ionen Mikrofabrikations Syst. GmbH, Schreygasse 3, 1020 Wien, Austria
来源
Microelectronic Engineering | 1999年 / 46卷 / 01期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:473 / 476
相关论文
共 50 条
[41]   Single-mask SOI fabrication process for linear and angular piezoresistive accelerometers with on-chip reference resistors [J].
Eklund, EJ ;
Shkel, AM .
2005 IEEE SENSORS, VOLS 1 AND 2, 2005, :656-659
[42]   Mechanistic studies of hydrophilic wafer bonding and Si exfoliation for SOI fabrication [J].
Weldon, MK ;
Marsico, V ;
Chabal, YJ ;
Christman, SB ;
Chaban, EE ;
Jacobson, DC ;
Sapjeta, JB ;
Pinczuk, A ;
Dennis, BS ;
Mills, AP ;
Goodwin, CA ;
Hsieh, CM .
1996 IEEE INTERNATIONAL SOI CONFERENCE PROCEEDINGS, 1996, :150-151
[43]   Wafer-to-Wafer Bonding Fabrication Process-Induced Wafer Warpage [J].
Feng, Wei ;
Shimamoto, Haruo ;
Kawagoe, Tsuyoshi ;
Honma, Ichirou ;
Yamasaki, Masato ;
Okutsu, Fumitake ;
Masuda, Takatoshi ;
Kikuchi, Katsuya .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2023, 36 (03) :398-403
[44]   An advanced modeling approach for mask and wafer process simulation [J].
Karakas, Ahmet ;
Elsen, Erich ;
Torunoglu, Ilhami ;
Andrus, Curtis .
PHOTOMASK TECHNOLOGY 2010, 2010, 7823
[45]   Thin Wafer Stencil Print Coating [J].
Schake, J. ;
Whitmore, M. ;
Foggie, D. ;
Brown, M. .
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2010 (CSTIC 2010), 2010, 27 (01) :327-337
[46]   STENCIL FABRICATION TECHNOLOGY [J].
VONVOSS, WD .
MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES, 1989, :305-311
[47]   Stencil technology for wafer level bumping [J].
Kay, Robert W. ;
Cummins, Gerard ;
Desmulliez, Marc P. Y. ;
Krebs, Thomas ;
Lathrop, Richard .
2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2012,
[48]   Fabrication of MEMS xylophone magnetometer by anodic bonding technique using SOI wafer [J].
Ram Aditi .
Microsystem Technologies, 2017, 23 :81-90
[49]   Fabrication and characterization of uniaxially strained SOI with wafer level by mechanical bending and annealing [J].
Wu, Shujing ;
Miao, Dongming ;
Dai, Xianying ;
Shao, Chenfeng ;
Hao, Yue .
AIP ADVANCES, 2018, 8 (04)
[50]   Anodic bonding using SOI wafer for fabrication of capacitive micromachined ultrasonic transducers [J].
Bellaredj, M. ;
Bourbon, G. ;
Walter, V. ;
Le Moal, P. ;
Berthillier, M. .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2014, 24 (02)