Chip Implementation on Hybrid Circuits and Printed Wiring Boards. Use of Automatic Machinery Constructed of Modules.

被引：0

作者：

Friedrich, D.

机构：

来源：

Elektronik Produktion & Prueftechnik | 1981年 / 10期

关键词：

PRINTED CIRCUITS - Manufacture;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The use of chip components makes it possible to increase the packaging density of circuits in comparison with conventional components. In addition, chip components do not require such processes as bending, cutting and crimping prior to placing them on the board as is usual with conventional components. Because of lesser space requirements of chip components, it is possible to design considerably shorter conduction paths.

引用

页码：531 / 535