Effect of aging on fatigue crack growth at Sn-Pb/Cu interfaces

被引：0
|
作者：
Yao, Daping [1 ]
Shang, J.K. [1 ]
机构：
[1] Univ of Illinois at Urbana-Champaign, Urbana, United States
来源：
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | 1995年 / 26 A卷 / 10期
关键词：
Fatigue of materials;
D O I：
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学科分类号：
摘要：
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页码：2677 / 2685
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