High density flex-rigid circuits-a solution for board-to-board transmission line interconnects

被引：0
|
作者：
Buck, T.J. [1 ]
机构：
[1] Advanced Interconnection Technology, Inc, Islip, United States
来源：
Circuit World | 1993年 / 19卷 / 04期
关键词：
14;
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摘要：
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页码：21 / 27
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