PROPER USE OF TIN AND TIN ALLOYS.

被引：0
|
作者：
Davis, Paul E.
Duffek, Edward F.
机构：
来源：
Electronic Packaging and Production | 1975年 / 15卷 / 07期
关键词：
TIN AND ALLOYS;
D O I：
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学科分类号：
摘要：
Deposits of tin, tin-lead and tin-nickel are commonly used as solderable coatings. The authors discuss the fallacies of some present beliefs concerning thin coatings. For example, poor solderability is really caused by the formation of an intermetallic compound at the interface of the base material and coating, and not by external surface oxidation.
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页码：86 / 88
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